Flexible benzoxazine resin
AssigneeIntegral Technology, Inc.
InventorsChristopher A. Hunrath, Khang Tran
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Abstract
One or more embodiments contained herein disclose an adhesive for printed circuit board (PCB) applications. The improved adhesive may comprise a benzoxazine resin and a polyester plasticizer.
Claims11
A composition of matter comprising a thermoset resin and a polyester plasticizer.
An adhesive film layer comprising about 75 wt % to about 95 wt % benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.
A layered film comprising an adhesive film layer, wherein the adhesive film layer comprises about 75 wt % to about 95 wt % of an uncured benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.
A printed circuit board comprising a layered film, wherein the layered film comprises an adhesive layer, wherein the adhesive film layer comprises about 75 wt % to about 95 wt % of an uncured benzoxazine resin and about 5 wt % to about 25 wt % of polyester plasticizer.
Dependencies are inferred from the claim text.