Laminated sheet for packaging electronic component and molded body thereof
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsJunpei Fujiwara, Masatoshi Kawata, Yasushi Miyamura
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AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsJunpei Fujiwara, Masatoshi Kawata, Yasushi Miyamura
Estimating the term…
The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 μm and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 μm, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.
A laminated sheet comprising a front surface layer, a core layer and a back surface layer,
Dependencies are inferred from the claim text.