Efficient material handling in semiconductor wafer processing

In a fabrication facility having a facility material handling system (AMHS) and a plurality of tools, the facility material handling system having a first AMHS that defines a transport route connecting the plurality of tools in the fabrication facility, the facility AMHS being configured to transport wafer carriers, a method comprising:

• installing a dedicated material handling module at the facility, said dedicated material handling module including a dedicated AMHS that defines a transport route connecting a first tool and a second tool selected from the plurality of tools, wherein the dedicated AMHS is configured to transport substrate carriers between the first tool and the second tool or vice versa independent of the facility AMHS.

In a fabrication facility having a facility material handling system (AMHS) and a plurality of tools, the facility material handling system having a first AMHS that defines a transport route connecting the plurality of tools in the fabrication facility, the facility AMHS being configured to transport wafer carriers, a method comprising:

• performing a first set of one or more wafer processing steps on one or more semiconductor wafers using a first tool of the plurality of tools;
• transferring the one or more semiconductor wafers from the first tool to a second tool selected from the plurality of tools in a wafer carrier via a dedicated material handling module, wherein the dedicated material handling module includes a dedicated AMHS that defines a transport route connecting the first tool and the second tool, wherein the dedicated AMHS is configured to transport substrate carriers between the first tool and the second tool or vice versa independent of the facility AMHS.