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US 2013/0294134 A1Published application
Stacked layer type semiconductor device and semiconductor system including the same
AssigneeSamsung Electronics Co., Ltd.
InventorHO CHEOL LEE
Life of this patent
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Abstract
A stacked layer type semiconductor device includes N memories each including at least one main via and (N−1) sub vias, the N memories being sequentially stacked on one-another so that central axes of the N memories face each other crosswise, and a plurality of connection units electrically connecting the N memories. Here, N is a natural number greater than 1.
Claims9
A stacked layer type semiconductor device comprising:
- a first memory comprising a first main via, a first sub via, and a first buffer electrically connected to the first main via and the first sub via;
- a second memory stacked on the first memory, and comprising a second main via electrically connected to the first main via, a second sub via electrically connected to the first sub via, and a second buffer electrically connected to the second main via and the second sub via;
- and
- at least one selection circuit for applying an access signal received from an external source to the first buffer and the second buffer along different paths at substantially the same time.
1 more element
A stacked layer type semiconductor device comprising:
- a first memory comprising a first main via, a first sub via, a first buffer electrically connected to the first main via, and a second buffer electrically connected to the first sub via;
- and
- a second memory stacked on the first memory, and comprising a second main via electrically connected to the first main via, a second sub via electrically connected to the first sub via, a third buffer electrically connected to the second main via, and a fourth buffer electrically connected to the second sub via,
- each of the first memory and the second memory comprises at least one selection applying an access signal received from an external source to the first or second buffer and to the third buffer or the fourth buffer along different paths at the same time.
1 more element
Dependencies are inferred from the claim text.