Thermally enhanced electronic package

A thermally enhanced electronic package, comprising:

• a flexible carrier including:
• a flexible substrate;
• a wiring layer formed on the substrate;
• and
• a resistant overlaying the wiring layer;
• a driver chip connected to the wiring layer;
• an insulator disposed between the driver chip and the flexible carrier;
• a first heat sink attached to the flexible substrate;
• and
• carbon nanocapsules disposed on the driver chip, on the resistant, on the flexible carrier, in the insulator, or on the first heat sink, wherein the heat generated from the driver chip is transferred by the carbon nanocapsules in a thermal radiation manner toward an opposite side of the driver chip with respect to the flexible carrier, and the carbon nanocapsule surfaces are processed to form electric insulating layers to avoid electrical short.