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US 2013/0293292 A1Published application
Interlayer communications for 3d integrated circuit stack
AssigneeIntel Corporation
InventorsGuido Droege, Niklas Linkewitsch, Andre Schaefer
Life of this patent
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Abstract
Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.
Claims24
An apparatus, comprising:
- two or more stacked die layers with active surfaces facing in the same direction;
- at least one interconnect passing through the two or more die layers and having an associated capacitance;
- and
- at least one receiver on at least one of the layers and at least one transmitter on at least one of the layers, wherein the at least one transmitter is connected to the interconnect through a coupling capacitor, the at least one transmitter and receiver to be coupled to each other through the interconnect via AC coupling.
1 more element
An apparatus, comprising:
- at least two integrated circuit (IC) layers including a core logic layer and one or more memory layers of different technologies;
- and
- a bus to communicatively link the at least two layers to each other, the bus including one or more interconnects connected through the at least three layers, wherein each layer includes at least one bus interface coupled to the interconnects through coupling capacitors.
An apparatus, comprising:
- two or more stacked die layers with active surfaces facing in the same direction;
- at least one interconnect passing through the two or more die layers and having an associated capacitance;
- and
- receivers and transmitters on the two or more layers, wherein at least one of the receivers is connected to the interconnect through a coupling capacitor, the transmitters and receivers to be coupled to each other through the interconnect via AC coupling.
1 more element
Dependencies are inferred from the claim text.