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AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsMeina Zhu, Jianjun Zhao, Hsiangyin Shih
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The present invention relates to a method for improving polyimide (PI) non-adherence to a substrate and a PI solution. The method includes the following steps: (1) providing a substrate and a PI solution, the PI solution comprising PI molecules and a solvent, the PI molecules having hydrophobic moieties; and (2) coating the PI solution on the substrate to form a PI film. The PI solution includes PI molecules and a solvent. The PI molecules have hydrophobic moieties. The solvent include N-methyl-2-pyrrolidone, γ-butyrolactone, butyl carbonate, or a mixture thereof. The PI molecules of the PI solution contain hydrophobic moieties and in coating the PI solution to a substrate, the hydrophobic moieties link with organic compounds on the substrate thereby enhancing affinity of the PI solution with surface of the substrate, improving the issue of PI non-adherence, and the heightening quality of printing the substrate.
A method for improving polyimide (PI) non-adherence to a substrate, comprising the following steps:
A method for improving polyimide (PI) non-adherence to a substrate, comprising the following steps:
A polyimide (PI) solution, which comprises PI molecules and a solvent, the PI molecules being linked with molecules having hydrophobic moieties and hydrophilic moieties in such a way that the hydrophilic moieties are linked with the PI molecules to graft the hydrophobic moieties to the PI molecules, the solvent comprising N-methyl-2-pyrrolidone, γ-butyrolactone, butyl carbonate, or a mixture thereof in which the hydrophobic moieties grafted PI molecules dissolve.
(canceled)
Dependencies are inferred from the claim text.