Back to results
US 2013/0280864 A1Published application
Stacked interconnect heat sink
AssigneeLSI Corporation
InventorsMark A. Bachman, John W. Osenbach, Sailesh M. Merchant
Life of this patent
Estimating the term…
Abstract
A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.
Claims13
A heat spreader configured to be attached to an electronic device substrate, comprising:
- a thermally conductive core;
- a heat spreader via passing through said thermally conductive core;
- and
- a connection point of said thermally conductive core configured to form a solder connection to an integrated circuit substrate plug.
1 more element
A method of forming an electronic device, comprising:
- providing an integrated circuit having a substrate;
- locating an active via within said substrate;
- and
- connecting said active via to a corresponding heat spreader via that passes through a thermally conductive core of a heat spreader.
1 more element
Dependencies are inferred from the claim text.