Method for fabricating array substrate and fabrication apparatus used therefor

A method for fabricating an array substrate, the method comprising:

• forming a semiconductor layer on a base substrate;
• forming a first conductive layer which is insulated from the semiconductor layer;
• performing a first cooling process for cooling the base substrate on which the first conductive layer is formed to a temperature of no greater than about 0° C.;
• performing a first heating process for heating the cooled base substrate on which the first conductive layer is formed to room temperature;
• patterning the first conductive layer to form a gate electrode;
• forming a second conductive layer which is insulated from the gate electrode and connected to the semiconductor layer;
• performing a second cooling process for cooling the base substrate on which the second conductive layer is formed;
• performing a second heating process for heating the cooled base substrate on which the second conductive layer is formed to room temperature;
• patterning the second conductive layer to form a source electrode and a drain electrode connected to the semiconductor layer;
• forming a third conductive layer connected to the drain electrode;
• performing a third cooling process for cooling the base substrate on which the third conductive layer is formed;
• performing a third heating process for heating the cooled base substrate on which the third conductive layer is formed to room temperature;
• and
• patterning the third conductive layer to form a pixel electrode connected to the drain electrode.

An apparatus for fabricating an array substrate, the apparatus comprising:

• a substrate treatment chamber configured to cool and heat a target substrate on which a conductive layer is disposed,
• wherein the substrate treatment chamber comprises:
• a chamber housing providing an inner space for receiving the target substrate;
• a cooling plate disposed in the inner space, wherein the cooling plate is configured to seat the target substrate thereon and to cool the target substrate;
• a substrate elevation device disposed under the cooling plate, wherein the substrate elevation device is configured to space the target substrate apart from the cooling plate;
• and
• a heating plate disposed in the inner space, wherein the heating plate is configured to heat the target substrate spaced apart from the cooling plate.

A method for fabricating an array substrate using an apparatus including a cooling chamber comprising a first chamber housing and a cooling plate disposed within the first chamber housing and a heating chamber comprising a second chamber housing and a heating plate disposed within the second chamber housing, the method comprising:

• cooling a target substrate on which a conductive layer is disposed on the cooling plate in the first chamber housing to a temperature of no greater than about 0° C.;
• transferring the cooled target substrate from the cooling plate onto the heating plate in the second chamber housing;
• and
• heating the cooled target substrate on the heating plate in the second chamber housing to room temperature.

A method for fabricating an array substrate using an apparatus including a substrate treatment chamber including a chamber housing, a cooling plate disposed in an inner space of the chamber housing, a substrate elevation device disposed under the cooling plate and a heating plate disposed in the inner space of the chamber housing and spaced apart from the cooling plate, the method comprising:

• cooling a target substrate on which a conductive layer is disposed on the cooling plate in the chamber housing to a temperature of no greater than 0° C.;
• operating the substrate elevation device to space the cooled target substrate apart from the cooling plate;
• and
• heating the cooled target substrate on the heating plate to room temperature.