Peeling system, peeling method, and computer storage medium

A method of peeling off a substrate to be processed and a support substrate from an overlapped substrate using a peeling system, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive,

• wherein the peeling system includes:
• a peeling process station provided with:
• a peeling device configured to peel off the substrate to be processed and the support substrate from the overlapped substrate;
• a first cleaning device configured to clean the substrate to be processed which is peeled by the peeling device;
• and a second cleaning device configured to clean the support substrate which is peeled by the peeling device;
• a carry-in/carry-out station configured to carry at least one of the substrate to be processed, the support substrate or the overlapped substrate in and out of the peeling process station;
• and
• a transfer station configured to transfer the at least one of the substrate to be processed, the support substrate or the overlapped substrate between the peeling process station and the carry-in/carry-out station,
• the method comprising:
• peeling, by the peeling device, the substrate to be processed and the support substrate from the overlapped substrate;
• cleaning, by the first cleaning device, the substrate to be processed which is peeled by the peeling process;
• and
• cleaning, by the second cleaning device, the support substrate which is peeled by the peeling process,
• wherein a pressure within the transfer station is higher than a pressure within the peeling device, a pressure within the first cleaning device and a pressure within the second cleaning device, and
• wherein a pressure within the transfer device is higher than the pressure within the peeling device and the pressure within the first cleaning device.

A computer readable storage medium having a control program operating on a computer stored thereon,

• wherein the control program, when executed, causes the computer to perform a method of peeling off a substrate to be processed and a support substrate from an overlapped substrate using a peeling system, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive,
• wherein the peeling system comprises:
• a peeling process station provided with a peeling device configured to peel off the substrate to be processed and the support substrate from the overlapped substrate;
• a first cleaning device configured to clean the substrate to be processed which is peeled by the peeling device;
• and a second cleaning device configured to clean the support substrate which is peeled by the peeling device;
• a carry-in/carry-out station configured to carry at least one of the substrate to be processed, the support substrate and the overlapped substrate in and out of the peeling process station;
• and
• a transfer station configured to transfer the at least one of the substrate to be processed, the support substrate and the overlapped substrate between the peeling process station and the carry-in/carry-out station,
• wherein the method comprises:
• peeling off, by the peeling device, the substrate to be processed and the support substrate from the overlapped substrate;
• cleaning, by the first cleaning device, the substrate to be processed which is peeled by the peeling process;
• and
• cleaning, by the second cleaning device, the support substrate which is peeled by the peeling process,
• wherein a pressure within the transfer station is higher than a pressure within the peeling device, a pressure within the first cleaning device and a pressure within the second cleaning device, and
• wherein a pressure within the transfer device is higher than the pressure within the peeling device and the pressure within the first cleaning device.