Methods Of Forming Material Over A Substrate And Methods Of Forming Capacitors
AssigneeMicron Technology, Inc.
InventorsZhe Song, Chris M. Carlson
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AssigneeMicron Technology, Inc.
InventorsZhe Song, Chris M. Carlson
Estimating the term…
A method of forming a material over a substrate includes performing at least one iteration of the following temporally separated ALD-type sequence. First, an outermost surface of a substrate is contacted with a first precursor to chemisorb a first species onto the outermost surface from the first precursor. Second, the outermost surface is contacted with a second precursor to chemisorb a second species different from the first species onto the outermost surface from the second precursor. The first and second precursors include ligands and different central atoms. At least one of the first and second precursors includes at least two different composition ligands. The two different composition ligands are polyatomic or a lone halogen. Third, the chemisorbed first species and the chemisorbed second species are contacted with a reactant which reacts with the first species and with the second species to form a reaction product new outermost surface of the substrate.
1-37. (canceled)
A method of forming a material over a substrate comprising performing at least one iteration of the following temporally separated ALD-type sequence:
A method of forming a material over a substrate comprising performing at least one iteration of the following temporally separated ALD-type sequence:
A method of forming a material over a substrate comprising performing at least one iteration of the following temporally separated ALD-type sequence:
A method of forming a material over a substrate comprising performing at least one iteration of the following temporally separated ALD-type sequence:
Dependencies are inferred from the claim text.