# US 2013/0277705 A1 · Light emitting device

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- Number: US 2013/0277705 A1
- Document ID: US20130277705A1
- Status: Published application
- Kind: A1
- Application number: 13/921,556
- Filed: 2013-06-19
- Published: 2013-10-24
- Earliest claimed: 2008-11-18
- Assignees: Seoul Semiconductor Co., Ltd.
- Applicants: Seoul Semiconductor Co., Ltd.
- Inventors: Eun Jung SEO; Jae Ho Cho; Bang Hyun Kim
- Web page: https://patentgrep.com/patent/US20130277705A1

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8506: {Containers}
- H10H 20/852: Encapsulations
- H10H 20/853: characterised by their shape
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/856: Reflecting means
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

## Claims

### Claim 1

A light-emitting device, comprising:
first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first surface, a second surface opposite to the first surface, and sidewalls arranged between the first surface and the second surface thereof, wherein at least one of the first and second lead frames comprises an inset sidewall, the inset sidewall undercutting at least one of the first surface and the second surface, and at least one of the first surface, the second surface, and the sidewalls of the first and second lead frames partially defining a fixing space;
a light-emitting diode chip arranged on the first surface of the first or second lead frame; and
a resin part disposed in the fixing space to support the first and second lead frames.

### Claim 2 (depends on 1)

The light-emitting device of claim 1, wherein the fixing space comprises a fixing hole arranged in at least one of the first and second lead frames.

### Claim 3 (depends on 2)

The light-emitting device of claim 2, wherein the fixing hole extends through a body of at least one of the first lead frame and the second lead frame.

### Claim 4 (depends on 1)

The light-emitting device of claim 1, wherein the first surface and the second surface of the at least one of the first and second lead frames comprise different surface areas from each other.

### Claim 5 (depends on 1)

The light-emitting device of claim 1, wherein the inset sidewall comprises a stepped structure.

### Claim 6 (depends on 1)

The light-emitting device of claim 1, wherein inset sidewalls are arranged on at least three sides of each of the first and second lead frames, and the stepped structure is arranged continuously on at least one of the at least three sides of the inset sidewalls.

### Claim 7 (depends on 1)

The light-emitting device of claim 1, wherein at least one sidewall of the first or second lead frame is inclined.

### Claim 8 (depends on 2)

The light-emitting device of claim 2, wherein the sidewalls are inclined.

### Claim 9 (depends on 1)

The light-emitting device of claim 1, further comprising a reflector arranged on the first surface of each of the first and second lead frames, the reflector surrounding the light-emitting diode chip.

### Claim 10 (depends on 1)

The light-emitting device of claim 1, wherein the resin part comprises a phosphor disposed therein.

### Claim 11 (depends on 2)

The light-emitting device of claim 2, wherein the inset sidewall comprises a concave portion, wherein the concave portion at least partially surrounds the fixing hole.

### Claim 12 (depends on 1)

The light-emitting device of claim 1, wherein each of the first and second lead frames comprises the inset sidewall.

### Claim 13 (depends on 7)

The light-emitting device of claim 7, wherein a corresponding first surface and second surface to the inclined sidewall comprise different surface areas from each other.

### Claim 14

A light-emitting device, comprising:
first and second lead frames spaced apart from each other, the first and second lead frames each comprising a first surface, a second surface opposite to the first surface, and sidewalls arranged between the first surface and the second surface thereof, wherein at least one of the first and second lead frames comprises an inset sidewall, the inset sidewall undercutting and surrounding at least three sides of the at least one of the first surface and the second surface, and at least one of the first surface, the second surface, and the sidewalls of the first and second lead frames partially defining a fixing space;
a light-emitting diode chip arranged on the first surface of the first or second lead frame; and
a resin part disposed in the fixing space to support the first and second lead frames.