Method for manufacturing printed circuit board
AssigneeLG Innotek Co., Ltd.
InventorIl Sang Maeng
Life of this patent
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Abstract
The embodiment relates to a printed circuit board. The printed circuit board includes an insulating substrate having a plurality of circuit pattern grooves, a conductive absorption layer including conductive particles absorbed into inner walls of the circuit pattern grooves and circuit patterns formed on the conductive absorption layer such that the circuit pattern grooves are filled with the circuit patterns. Since the electroplating process is selectively performed with respect to inner portions of the pattern grooves by using the conductive absorption layer as a seed layer, the plating layer is not formed on the insulating layer except for the pattern grooves, so that the etching process for the electroplating layer is not necessary and the patterns are stably formed.
Claims14
A method for manufacturing a printed circuit board, the method comprising:
- preparing an insulating substrate;
- sequentially forming a first metal layer, an interlayer dielectric layer and a second metal layer on the insulating substrate;
- performing an etching process from the second metal layer to a surface of the insulating substrate to form a plurality of circuit pattern grooves on the surface of the insulating substrate;
- forming a conductive absorption layer through an absorption of conductive particles into inner walls of the circuit pattern grooves;
- and
- forming circuit patterns by performing an electroplating process using the conductive absorption layer as a seed layer such that the circuit pattern grooves are filled with the circuit patterns.
A printed circuit board comprising:
- an insulating substrate having a plurality of circuit pattern grooves;
- a conductive absorption layer including conductive particles absorbed into inner walls of the circuit pattern grooves;
- and
- circuit patterns on the conductive absorption layer, the circuit pattern grooves being filled with the circuit patterns.
Dependencies are inferred from the claim text.