Methods for Forming Through Vias

A method, comprising:

• providing a layer of uncured encapsulation material;
• inserting an upper mold tool having a first plurality of pillars into the encapsulation layer to imprint through vias extending through the encapsulation layer;
• curing the encapsulation layer and the through vias;
• removing the upper mold tool from the encapsulation layer;
• and
• disposing conductor material within the through vias to make electrical connectors within the through vias.

A method comprising:

• providing a substrate having conductive pads for making electrical connections on a first surface;
• mounting an integrated circuit to the first surface of the substrate, the integrated circuit having bond pads for making electrical connections on an upper surface;
• disposing an uncured encapsulation layer over the first surface of the substrate and over the upper surface of the integrated circuit;
• positioning the substrate and the uncured encapsulation layer into a mold;
• inserting an upper mold tool into the encapsulation layer, the upper mold tool having a first plurality of pillars into the encapsulation layer to imprint through vias extending to the first surface of the substrate and having a second plurality of pillars to imprint blind vias extending to the bond pads of the integrated circuit;
• curing the encapsulation layer and the through vias and the blind vias;
• removing the upper mold tool from the encapsulation layer;
• and
• disposing conductor material within the through vias and the blind vias to make electrical connectors within the through vias and the blind vias;
• and
• forming external connectors over the encapsulation layer.