Selective transfer of active components

A method for selectively transferring active components from a source substrate to a destination substrate, comprising the steps of:

• a) providing a source wafer having a sacrificial layer formed over the source wafer and an active layer formed on the sacrificial layer;
• b) processing the source wafer to form one or more active component(s) in or on the active layer and a trench around each of the active component(s), the trench extending through the active layer to the sacrificial layer;
• c) removing the sacrificial layer except for breakable tethers to release the active components from the source substrate;
• d) providing a destination substrate having a receiving side;
• e) locating a selectively curable adhesive layer between and adjacent to the receiving side of the destination substrate and the active component side of the source wafer, the selectively curable adhesive layer having separate areas between each of the active component(s) and the receiving side of the destination substrate;
• f) selecting one or more active components;
• g) selectively curing the adhesive layer in selected area(s) of the adhesive layer corresponding to the selected active components to adhere the selected active components to the receiving side of the destination substrate in the selected area(s);
• and
• h) breaking the tethers by removing the source substrate and the adhesive layer from the destination substrate leaving the selected active components adhered to the receiving side of the destination substrate in the selected area(s).

A method for selectively transferring active components from a source substrate to a destination substrate, comprising the steps of:

• a) providing a source substrate having an active side and one or more active components located on the active side of the source substrate;
• b) providing a destination substrate having a receiving side coated with a selectively curable adhesive;
• c) providing a stamp;
• d) pressing the stamp against the active components to adhere the active components to the stamp;
• e) stamping the active components onto the receiving side of the destination substrate to adhere the first active components to the receiving side of the destination substrate;
• f) selectively curing the selectively curable adhesive layer in the areas corresponding to the active components;
• g) removing the stamp from the destination substrate leaving the first active components adhered to the receiving side of the destination substrate.

A method for selectively transferring active components from a source substrate to a destination substrate, comprising the steps of:

• a) providing a source substrate having an active side and one or more active components located on the active side of the source substrate;
• b) providing a destination substrate having a receiving side;
• c) providing a stamp;
• d) locating a selectively adhesive layer between and adjacent to the stamp and the active side of the source substrate, the selectively adhesive layer having separate areas between each of the active component(s) and the stamp, thereby laminating the active components to the stamp;
• e) selecting one or more first active components having corresponding first selected areas and one or more remaining second active components having corresponding second selected areas;
• f) selectively delaminating the selectively adhesive layer in the second selected area(s) and removing the stamp from the source substrate leaving the first active components laminated to the stamp;
• and
• g) stamping the first active components onto the receiving side of the destination substrate to adhere the first active components to the receiving side of the destination substrate;
• h) removing the stamp from the destination substrate leaving the first active components adhered to the receiving side of the destination substrate.