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US 2013/0273694 A1Published application
Integrated Thermal Solutions for Packaging Integrated Circuits
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Chieh Hsieh, Shang-Yun Hou, Shin-Pun Jeng
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Abstract
A method includes attaching a wafer on a carrier through an adhesive, and forming trenches in the carrier to convert the carrier into a heat sink. The heat sink, the carrier, and the adhesive are sawed into a plurality of packages.
Claims20
A method comprising:
- attaching a wafer on a carrier through an adhesive;
- forming trenches in the carrier to convert the carrier into a heat sink;
- and
- sawing the heat sink, the carrier, and the adhesive into a plurality of packages.
1 more element
A method comprising:
- attaching a semiconductor wafer to a carrier through an adhesive;
- after the step of attaching, forming conductive features on the semiconductor wafer, wherein the conductive features are electrically coupled to devices in the semiconductor wafer;
- after the step of forming the conductive features, forming trenches in the carrier to convert the carrier into a heat sink;
- and
- sawing the heat sink, the carrier, and the adhesive into a plurality of packages.
2 more elements
A method comprising:
- attaching a wafer to a carrier through an adhesive;
- after the step of attaching, thinning the wafer;
- after the step of thinning, forming trenches in the carrier to convert the carrier into a heat sink;
- and
- sawing the heat sink, the carrier, and the adhesive into a plurality of packages.
2 more elements
Dependencies are inferred from the claim text.