System for Wafer-Level Phosphor Deposition
AssigneeBridgelux, Inc.
InventorTao Xu
Life of this patent
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Abstract
System for wafer-level phosphor deposition. In an aspect, a semiconductor wafer is provided that includes a plurality of LED dies wherein at least one die includes an electrical contact, a photo-resist post covering the electrical contact, and a phosphor deposition layer covering the semiconductor wafer and surrounding the photo-resist post. In another aspect, a semiconductor wafer is provided that comprises a plurality of LED dies wherein at least one die comprises an electrical contact, a phosphor deposition layer covering the semiconductor wafer, and a cavity in the phosphor deposition layer exposing the at least one electrical contact.
Claims6
A method for depositing a phosphor layer on a semiconductor wafer comprising:
- obtaining a light emitting diode (“LED”) wafer containing a plurality of LED dies;
- attaching the LED wafer to a support carrier wafer;
- depositing a photo-resist layer on the LED wafer;
- removing portions of the photo-resist layer to form photo-resist posts covering electrical contacts of the LED dies;
- and
- depositing a phosphor layer on the LED wafer to surround the photo-resist posts.
The method of claim 12 further comprising:
- removing the photo-resist posts to expose the electrical contacts of the LED dies.
- removing the carrier wafer;
- and
- singulating the LED dies.
The method of claim 13, wherein attaching the LED wafer to a supporting carrier wafer includes utilizing a thermal releasing adhesive layer.
The method of claim 14, wherein the supporting carrier wafer includes providing sapphire carrier wafer.
The method of claim 15, wherein the removing of the supporting carrier wafer includes heating thermal releasing adhesive layer.
The method of claim 13, wherein the singulation of the LED dies includes utilizing a front-side laser scribing and breaking device.
Dependencies are inferred from the claim text.