Apparatus and Method for Endpoint Detection During Electronic Sample Preparation
OwnerJames Barry Colvininventor
Life of this patent
Estimating the term…
Abstract
An apparatus for endpoint detection during removal of material from an electronic component includes a mounting plate operable to provide physical and electrical attachment for a device-under-test (DUT), a spindle operable to hold a tip for removing material from the DUT, a signal generator operable to provide an input signal to a first electrode, and a microprocessor connected to use an output signal from a second electrode to terminate the removal of material when an endpoint is reached, the first electrode being one of the tip and the DUT and the second electrode being the opposite one of the tip and the DUT.
Claims20
An apparatus for endpoint detection during removal of material from an electronic component, the apparatus comprising:
- a mounting plate operable to provide physical and electrical attachment for a device-under-test (DUT);
- a spindle operable to hold a tip for removing material from the DUT, the tip operable to carry a signal during the removal;
- a signal generator operable to provide an input signal to a first electrode;
- and
- a microprocessor connected to use an output signal from a second electrode to terminate the removal of material when an endpoint is reached, the first electrode being one of the tip and the DUT and the second electrode being the opposite one of the tip and the DUT.
A method for detecting an endpoint during removal of material from an electronic device, the method comprising:
- characterizing at least one electronic device as to an inherent relationship between a given characteristic of the at least one electronic device and a thickness of material remaining over a given target, the at least one electronic device having been produced using a given process;
- determining an endpoint value based on the characterized relationship and a desired amount of material to be left over the given target;
- while removing material from an electronic device-under-test (DUT) using a tip driven by a spindle, the DUT having been produced using the given process, applying an input signal to a first electrode;
- and
- using an output signal received from a second electrode to terminate the removal of material when the output signal reaches the endpoint value, the first electrode being one of the tip and the DUT and the second electrode being the opposite one of the tip and the DUT.
Dependencies are inferred from the claim text.