Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

A heat dissipation feature adapted for use in an electronic device, the heat dissipation feature comprising:

• a base adapted to facilitate conductive heat transfer from a heat-generating component;
• a plurality of protrusions extending from the base, wherein the plurality of protrusions are adapted for exposure external to an enclosure of an electronic device;
• and
• a thermally insulating material disposed on at least a tip portion of at least some protrusions of the plurality of protrusions, wherein the thermally insulating material is selected to comprise respective values for properties of thermal conductivity (k), density (ρ), and specific heat (Cp) such that a product of these values (k*ρ*Cp) is less than a product of values for the same properties k*ρ*Cp for human skin.

A method of making an electronic device, comprising:

• forming a base and a plurality of protrusions extending from the base;
• disposing a thermally insulating material on at least a tip portion of at least some protrusions of the plurality of protrusions, wherein the thermally insulating material comprises respective values for properties of thermal conductivity (k), density (ρ), and specific heat (Cp) such that a product of these values (k*ρ*Cp) is less than a product of values for the same properties k*ρ*Cp for human skin;
• and
• disposing the base in relation to at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component to the base and the plurality of protrusions.