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US 2013/0270718 A1Published application
Printed circuit board having embedded dies and method of forming same
AssigneeQUALCOMM Incorporated
InventorsFifin Sweeney, Jason R. Gonzalez
Life of this patent
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Abstract
A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.
Claims19
A package comprising:
- a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side;
- and
- a stacked die comprising a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB.
A system comprising:
- a printed circuit board (PCB) means having a top surface;
- an opening means formed on the top surface;
- a stacked die means comprising a top die means and a bottom die means, the stacked die means formed in the opening means;
- laminating means for laminating the PCB means;
- and
- means for forming an electrical connection with the stacked die means.
3 more elements
Dependencies are inferred from the claim text.