Semiconductor Device Packages and Methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Ding Wang, Hung-Jen Lin, Jiun Yi Wu, Mirng-Ji Lii, Chien-Hsun Lee
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Abstract
Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.
Claims20
A package for a semiconductor device, comprising:
- a substrate;
- a contact pad disposed on a first surface of the substrate, the contact pad having a first side and a second side opposite the first side;
- a conductive trace coupled to the first side of the contact pad;
- an extension of the conductive trace coupled to the second side of the contact pad;
- and
- a plurality of bond pads disposed on a second surface of the substrate.
A packaged semiconductor device, comprising:
- a package, the package including:
- a substrate;
- a contact pad disposed on a top surface of the substrate, the contact pad having a first side and a second side opposite the first side;
- a conductive trace coupled to the first side of the contact pad;
- an extension of the conductive trace coupled to the second side of the contact pad;
- and
- a plurality of bond pads disposed on a bottom surface of the substrate;
- and
- an integrated circuit die coupled to the contact pad on the top surface of the substrate of the package.
A method of packaging a semiconductor device, the method comprising:
- providing a package, the package including:
- a substrate;
- an array region comprising a plurality of first contact pads and a plurality of second contact pads disposed on a first surface of the substrate, the array region having a plurality of corners, wherein one of the plurality of first contact pads is disposed in each of the plurality of corners of the array region, the first contact pads having a first side and a second side opposite the first side;
- a conductive trace coupled to the first side of each of the first contact pads;
- an extension of the conductive trace coupled to the second side of each of the first contact pads;
- and
- a plurality of bond pads disposed on a bottom surface of the substrate;
- providing an integrated circuit die;
- and
- coupling the integrated circuit die to the first contact pads and the plurality of second contact pads in the array region of the package.
Dependencies are inferred from the claim text.