System and methods for wire bonding

A method of forming a semiconductor package, the method comprising:

• patterning a passivation layer to form a bond pad in a first semiconductor die;
• forming a raised conductive area over a passivation layer of a second semiconductor die;
• and
• forming a ball bond on the bond pad in the first semiconductor die and a stitch bond directly on a surface of the raised conductive area to couple a bond wire between the bond pad and the raised conductive area.

A method of forming a bond wire interconnect, the method comprising:

• forming a ball bond to attach a first end of a bond wire to a bond pad;
• looping the bond wire to a raised conductive area disposed on top of a passivation layer without breaking the bond wire after forming the ball bond;
• and
• forming a stitch bond directly on a surface of the raised conductive area to couple a second end of the bond wire directly to the surface of the raised conductive area.