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AssigneeHitachi, Ltd.
InventorsYoshinori Negishi, Hiroshi Nakano, Eiichi Ide, Haruo Akahoshi, Motoko Harada, Toshiaki Ishii
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The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.
A power module comprising:
A lead frame for a power module, comprising a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on other side, opposite to a side on which to mount a semiconductor device, of the conductor plate.
Dependencies are inferred from the claim text.