Optoelectronic package and method for making same

A method for making an optoelectronic package, the method comprising:

• applying a first adhesive to a first adhesive bonding area of a cover element;
• placing the cover element onto a substrate so that the first adhesive bonding area of the cover element is in direct contact with a predetermined region of the substrate;
• curing the first adhesive so as to secure the cover element onto the substrate;
• applying a second adhesive to a second adhesive bonding area defined between the cover element and the substrate;
• and
• curing the second adhesive;
• wherein:
• the second adhesive bonding area is defined through the engagement of the cover element and the substrate, and configured to allow the second adhesive to be in direct contact with both the cover element and the substrate, and confined within a localized area.

An optoelectronic package comprising:

• a substrate;
• a cover element bonded onto the substrate, the cover element defining a cavity for accommodating semiconductor chips and optoelectronic components, and comprising functional features aligned with the optoelectronic components;
• wherein:
• the cover element comprises a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive;
• and
• the engagement of the cover element and the substrate defines a second adhesive bonding area, the second adhesive bonding area being configured for receiving a second adhesive and confining the second adhesive within a localized area.