Lid attach process and apparatus for fabrication of semiconductor packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChin-Liang CHEN, Wei-Ting LIN, Yu-Chih LIU, Kuan-Lin HO, Jason SHEN
Life of this patent
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Abstract
A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.
Claims20
A semiconductor package assembly process, comprising:
- attaching one or more dies to a substrate;
- applying an adhesive material on a periphery of the substrate by an adhesive dispenser;
- applying a thermal interface material (TIM) on a top surface of the die;
- and
- positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier, to encapsulate the one or more dies.
A semiconductor package assembly process, comprising:
- attaching one or more dies to a substrate;
- applying concurrently an adhesive material on a periphery of the substrate and a thermal interface material (TIM) on a top surface of the die by a combination adhesive and TIM dispenser;
- and
- positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier, to encapsulate the one or more dies.
A lid attach process, comprising:
- attaching one or more dies to a substrate;
- applying a thermal interface material TIM on a top surface of the die;
- providing a lid and dipping a periphery of the lid by a lid carrier in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid;
- and
- positioning the lid over the one or more dies and placing the lid on a top of the TIM with the adhesive material being adapted to interface with a periphery of the substrate.
An adhesive dispenser comprising a stamp-type dispensing head for applying an adhesive material to a substrate, the adhesive dispenser having a container for storing the adhesive material and one or more conduits in the stamp-type dispensing head for dispensing the adhesive material therethrough by a pump extrusion force.
A TIM dispenser comprising a stamp-type dispensing head for applying a thermal interface material (TIM) to a die, the TIM dispenser having a container for storing the TIM and one or more conduits in the stamp-type dispensing head for dispensing the TIM from the container and through the one or more conduits by a pump extrusion force.
A combination adhesive and thermal interface material (TIM) dispenser comprising a stamp-type dispensing head for applying an adhesive material to a substrate and a TIM to a die, the combination dispenser having a container for storing the adhesive material and/or TIM, and one or more conduits in the stamp-type dispensing head for dispensing the adhesive material and/or TIM from the container and through the one or more respective conduits by a pump extrusion force.
Dependencies are inferred from the claim text.