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US 2013/0259092 A1Published application
System and method for predicting the temperature of a device
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-hyeok IM, Kyol Park, Tae-je Cho
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Abstract
A method of predicting a temperature includes operatively coupling a temperature prediction circuit to a device including a semiconductor chip, determining a correlation between a current and voltage of the temperature prediction circuit, and predicting a temperature with respect to power applied to the device using the determined correlation.
Claims20
A method of predicting a temperature, comprising:
- operatively coupling a temperature prediction circuit to a device comprising a semiconductor chip;
- determining a correlation between a current and a voltage of the temperature prediction circuit;
- and
- predicting a temperature with respect to power applied to the device using the determined correlation.
1 more element
A method of predicting a temperature, comprising:
- measuring a unit step response to temperature relative to time by applying power to a device comprising a semiconductor chip;
- calculating an impulse response of temperature relative to time for the device;
- collecting power data applied according to an operation of the device;
- and
- predicting a temperature according to the operation of the device by convolution integrating the collected power data and the impulse response.
2 more elements
A method of predicting a temperature, comprising:
- operatively coupling a temperature prediction circuit to a device comprising a semiconductor chip;
- applying a current to the temperature prediction circuit;
- measuring a voltage at a node of the temperature prediction circuit, wherein the node corresponds to the semiconductor chip of the device;
- and
- predicting a temperature of the device based on the current applied to the temperature prediction circuit and the voltage measured at the node of the temperature prediction circuit.
2 more elements
Dependencies are inferred from the claim text.