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US 2013/0258632 A1Published application
Joining sheet, electronic component, and producing method thereof
AssigneeNitto Denko Corporation
InventorsHirofumi EBE, Yoshihiro FURUKAWA
Life of this patent
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Abstract
A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
Claims10
A joining sheet comprising:
- a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and
- a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
A method for producing an electronic component comprising the steps of:
- preparing a laminate in which a joining sheet is disposed between two pieces of wired circuit boards arranged so that corresponding terminals thereof are spaced in opposed relation to each other, wherein
- the joining sheet comprises
- a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and
- a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin;
- and
- heating the laminate at a temperature that is not less than the melting point of the solder particles.
3 more elements
An electronic component obtained by a method for producing an electronic component, wherein
- the method for producing an electronic component comprises the steps of:
- preparing a laminate in which a joining sheet is disposed between two pieces of wired circuit boards arranged so that corresponding terminals thereof are spaced in opposed relation to each other, and
- the joining sheet comprises
- a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and
- a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin;
- and
- heating the laminate at a temperature that is not less than the melting point of the solder particles.
4 more elements
Dependencies are inferred from the claim text.