High frequency module
AssigneeKabushiki Kaisha Toshiba
InventorKoichiro GOMI
Life of this patent
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Abstract
A module has a circuit board having a through-hole which separates a transmitter for transmitting the high frequency signal and a receiver for receiving the high frequency signal, both on the circuit board. The circuit board includes an insulating layer and a wiring layer. The wiring layer is formed in the ends of the insulating layer. A cover shields the transmitter and the receiver and has a partition part. The partition part is electrically connected with the wiring layer and has a groove portion communicating with the through-hole, and is electrically connected with the wiring layer at the periphery of the through-hole. The depth of the groove portion L from a contact surface with the wiring layer satisfies L=n×λ/2 Where, n is a natural number and λ is a wavelength of the high-frequency signal.
Claims7
A high frequency module, comprising:
- a frame;
- a circuit board with a through-hole, comprising an insulating layer and a wiring layer, the wiring layer being arranged to cover the ends of the insulating layer and the periphery of the through-hole, the wiring layer being electrically connected to the frame;
- a first circuit and the second circuit provided on the circuit board being separated by the through-hole, the first circuit transmitting a high-frequency signal to outside, the second circuit receiving a high-frequency signal from the outside;
- and
- a cover to shield over the first circuit and the second circuit, the cover being electrically connected with the wiring layer at the end of the insulating layer, the cover having a partition part for shielding the second circuit from the first circuit, the partition part being electrically connected with the wiring layer in the periphery of the through-hole at a contact surface,
- wherein,
- the partition part has a groove portion to communicate with the through-hole and the groove portion has a depth L from the contact surface,
- the depth L satisfy a formula of
- L=n×λ/2
- where n is a natural number, λ is a wavelength of the high-frequency signal.
High frequency module, comprising:
- a frame;
- a circuit board having a through-hole, comprising an insulating layer and a wiring layer, the wiring layer being arranged to cover the ends of the insulating layer and the periphery of the through-hole, the wiring layer being electrically connect with the frame;
- a first circuit and a second circuit provided on the circuit board, the first circuit transmitting a high-frequency signal to outside, the second circuit receiving the high-frequency signal from the outside, the first circuit and the second circuit being separated by the through-hole;
- and
- a cover to shield over the first circuit and the second circuit, the cover being electrically connected with the wiring layer at the end of the insulating layer, the cover having a partition part for shielding the second circuit from the first circuit, the partition part being electrically connected with the wiring layer at a contact surface in the periphery of the through-hole;
- wherein,
- a groove portion comprising the through-hole, an one end of the groove portion being closed at a surface of the frame, and the groove portion has a depth L from the contact surface via the through-hole to the surface of the frame,
- the depth L satisfy a formula of
- L=n×λ/2
- where n is a natural number, λ is a wavelength of the high-frequency signal.
A high frequency module, comprising:
- a frame;
- a circuit board with a through-hole, comprising an insulating layer and a wiring layer, the wiring layer being arranged to cover the ends of the insulating layer and the periphery of the through-hole, the wiring layer being electrically connected to the frame;
- a first circuit and the second circuit provided on the circuit board being separated by the through-hole, the first circuit transmitting a high-frequency signal to outside, the second circuit receiving a high-frequency signal from the outside;
- and
- a cover to shield over the first circuit and the second circuit, the cover being electrically connected with the wiring layer at the end of the insulating layer, the cover having a partition part for shielding the second circuit from the first circuit, the partition part being electrically connected with the wiring layer in the periphery of the through-hole at a contact surface,
- wherein,
- a groove portion is provide in at least one of the partition part, or the through-hole and the frame, the groove portion has a depth L from the contact surface,
- the depth L satisfy a formula of
- L=n×λ/2
- where n is a natural number, λ is a wavelength of the high-frequency signal.
Dependencies are inferred from the claim text.