Surface inspection tool and surface inspection method
AssigneeHitachi High-Technologies Corporation
InventorsYuji MIYOSHI, Tomohiro FUNAKOSHI
Life of this patent
Estimating the term…
Abstract
A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
Claims9
1-13. (canceled)
A system for acquiring scattering light distribution of an object formed on a pattern, comprising:
- an illumination unit which irradiates the object with light;
- a detection unit which detects scattered light from the object;
- and
- a processing unit which acquires a scattering light distribution image from a detection result of the detection unit.
A method for acquiring scattering light distribution of an object formed on a pattern, the method comprising the steps of:
- irradiating the object with light;
- detecting scattered light from the object;
- and
- acquiring a scattering light distribution image from the detected scattered light.
Dependencies are inferred from the claim text.