Array substrate structure and display panel and manufacturing method thereof
AssigneeInnolux Corporation
InventorsYu-Tsung Liu, Te-Yu Lee
Life of this patent
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Abstract
An array substrate structure including a first substrate, a plurality of thin film transistors, a first dielectric layer, a second dielectric layer, and a second electrode layer is provided. Each of the thin film transistors has a patterned first electrode layer which is disposed on the first electrode layer and has a first through hole. The second dielectric layer is disposed on the first dielectric layer and has a second through hole. The second through hole is connected to the first through hole, such that the second electrode layer is electrically connected to the first electrode layer via the first through hole and the second through hole.
Claims20
An array substrate structure, comprising:
- a first substrate;
- a plurality of thin film transistors disposed on the first substrate, wherein a top portion of each of the thin film transistors has a first electrode layer which is patterned;
- a first dielectric layer disposed on the first electrode layer and covering the thin film transistors, wherein a part of the first electrode layer of each of the thin film transistors corresponding to the first dielectric layer has at least one first through hole;
- a second dielectric layer disposed on the first dielectric layer, wherein the second dielectric layer has a second through hole connected to the first through hole;
- and
- a second electrode layer disposed on the second dielectric layer, wherein the second electrode layer is electrically connected to the first electrode layer via the first through hole and the second through hole.
A manufacturing method of an array substrate structure, comprising:
- providing a first substrate;
- forming a plurality of thin film transistors on the first substrate, wherein a top portion of each of the thin film transistors has a patterned first electrode layer;
- forming a first dielectric material layer deposed on the first electrode layer;
- forming a second dielectric material layer deposed on the first dielectric material layer;
- providing a photo-resist layer deposed on the second dielectric material layer;
- etching the first dielectric material layer and the second dielectric material layer according to the photo-resist layer as a mask to form a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a first through hole, and the second dielectric layer has a second through hole at a location corresponding to the fist through hole and connected to the first through hole;
- and
- forming a second electrode layer deposed on the second dielectric layer, wherein the second electrode layer is electrically connected to the first electrode layer via the first through hole and the second through hole.
Dependencies are inferred from the claim text.