Camera module
AssigneeLG Innotek Co., Ltd.
InventorJungsik Lee
Life of this patent
Estimating the term…
Abstract
The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
Claims11
A camera module, the camera module comprising:
- a PCB;
- an image sensor mounted on the PCB and formed with an image pickup device;
- a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR (infrared) filter, and accommodated with a connection lead therein, and corner pillar portions each erected at a corner portion of the plated portion;
- a lower spring plate formed with a conductive material, and connected to the connection lead of the base for coupling with an upper surface of the plated portion;
- a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate;
- a lens actuator including a bobbin elastically supported by the lower spring plate and accommodated inside a lens assembly, and a yoke wrapping the bobbin and coupled among the corner pillar portions of the base and stacked at an upper surface of the spacer;
- an upper spring plate coupled to an upper surface of the lens actuator to supportively apply a pressure to the lens actuator;
- and
- a cover attached to an upper surface of the upper spring plate and formed thereon with a hole.
A camera module, the camera module comprising:
- a PCB;
- an image sensor mounted on the PCB and formed with an image pickup device;
- a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR (infrared) filter, and corner pillar portions each erected at a corner portion of the plated portion;
- a lower spring plate formed with a conductive material, and coupled to an upper surface of the plated portion of the base;
- a lens actuator including a bobbin elastically supported by the lower spring plate and accommodated inside a lens assembly, and a yoke wrapping the bobbin and coupled to an upper surface of the base;
- an upper spring plate coupled to an upper surface of the lens actuator to supportively apply a pressure to the lens actuator;
- and
- a cover arranged on an upper surface of the upper spring plate, coupled to a corner pillar portion of the base and formed thereon with a hole, wherein an upper surface of the plated portion of the base is formed with an accommodation structure inwardly stair-cased for accommodating the lower spring plate.
Dependencies are inferred from the claim text.