Bi-directional camera module and flip chip bonder including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Sick PARK, Myung-Sung KANG, Ji-Seok HONG
Life of this patent
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Abstract
Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.
Claims20
A bi-directional camera module comprising:
- a circuit board on which an upper sensor and a lower sensor are mounted;
- an upper lens and a lower lens on the upper sensor and under the lower sensor, respectively;
- and
- a housing holding the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively, the housing surrounding the circuit board,
- wherein the housing has at least one inlet and an outlet through which air flows;
- and
- wherein the housing has an air passage connected from the at least one inlet to the outlet via a space between lower lens and the lower sensor.
A flip chip bonder comprising:
- a stage;
- a heater on the stage;
- a guide frame adjacent to the stage;
- a first guide moving part configured to move along the guide frame;
- a bonding head configured to move onto the heater by the first guide moving part;
- a second guide moving part separated from the first guide moving part, the second guide moving part configured to move along the guide frame;
- and
- a bi-directional camera module between the bonding head and the heater by the second guide moving part, wherein the bi-directional camera module includes:
- a circuit board on which an upper sensor and a lower sensor are mounted;
- an upper lens and a lower lens on the upper sensor and under the lower sensor, respectively;
- and
- a housing holding the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively, the housing surrounding the circuit board;
- wherein the housing has at least one inlet and an outlet through which air flows;
- and
- wherein the housing has an air passage connected from the at least one inlet to the outlet via a space between lower lens and the lower sensor.
A bi-directional camera module for aligning a flip chip with a substrate, the bi-directional camera module comprising:
- a housing;
- a printed circuit board (PCB) in the housing;
- a first sensor coupled to a top surface of the PCB, the first sensor configured to detect a fiducial mark of the flip chip;
- a second sensor coupled to a bottom surface of the PCB, the second sensor configured to detect a fiducial mark of the substrate;
- a first lens over the first sensor, the first lens held by the housing at least at two opposite sides thereof, the first lens enlarging a surface image of the flip chip;
- a second lens under the second sensor, the second lens held by the housing at least at two opposite sides thereof, the second lens enlarging a surface image of the substrate;
- and
- an air circulator configured to supply a cooling air or a warm air, the air circulator configured to maintain the second lens at a substantially constant temperature or within a desired temperature range.
Dependencies are inferred from the claim text.