Providing Voltage Isolation On A Single Semiconductor Die

An apparatus comprising:

• a first semiconductor package including:
• a first semiconductor die having a first transmitter circuit to receive an input signal and to output a differential signal corresponding to the input signal, and an isolation circuit including a first pair of isolation capacitors to receive the differential signal and a second pair of isolation capacitors coupled to the first pair of isolation capacitors to receive the differential signal and to output an isolated differential signal;
• and
• a second semiconductor package coupled to the first semiconductor package, the second semiconductor package including:
• a second semiconductor die to receive the isolated differential signal from the first semiconductor die via first and second input pads, wherein the isolation circuit of the first semiconductor package provides complete voltage isolation between the first and second semiconductor packages.

A method comprising:

• receiving an input signal in transmitter circuitry of a first semiconductor die and processing the input signal;
• transmitting the processed input signal to an isolation circuit of the first semiconductor die to generate a voltage isolated signal;
• and
• providing the voltage isolated signal from the isolation circuit to a second semiconductor die coupled to the first semiconductor die via a bonding mechanism, the second semiconductor die not having isolation circuitry.