Tree based adaptive die enumeration
AssigneeAdvanced Micro Devices, Inc.
InventorSophocles R. Metsis
Life of this patent
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Abstract
A system and method for efficiently addressing dies in a three-dimensional stacked integrated circuit. Multiple stacked dies may be included in a single package or module. At least two of the dies are vertically stacked. One or more of the dies may include die enumeration logic that generates a unique die address space identifier (ID) for a particular die. Unless a die is a base die, each die receives a unique die ID for itself from a die placed below itself. The die then generates a unique die ID for one or more dies placed above itself and sends these die IDs to the dies located on top of itself. If a die is a base die, then the logic may receive a root value for a first unique die ID within the vertical stack from the package substrate or silicon based interposer beneath it.
Claims20
A stacked integrated circuit comprising:
- a plurality of dies wherein at least two dies of the plurality of dies are vertically stacked and at least one given die of the plurality of dies comprises die enumeration logic;
- wherein said logic is configured to:
- receive a first die identifier (ID) from a first die of the plurality of dies placed below the given die;
- alter the received first die ID based on a number of dies placed above the given die in order to generate a second die ID;
- and
- send the second die ID to a second die of the plurality of dies placed above the given die.
A method for die enumeration of stacked dies comprising:
- receiving a first die identifier (ID) from a first die of a plurality of dies placed below a given die of the plurality of dies;
- altering the received first die ID based on a number of dies placed above the given die in order to generate a second die ID;
- and
- sending the second die ID to a second die of the plurality of dies placed above the given die.
A semiconductor die included in a multi-die stacked configuration comprising:
- a first interface to a first die placed below itself;
- a second interface to a second die placed above itself;
- and
- control logic configured to:
- receive a first die identifier (ID) from the first die;
- alter the received first die ID based on a number of dies placed above itself in order to generate a second die ID;
- and
- send the second die ID to the second die.
Dependencies are inferred from the claim text.