Microelectromechanical system package and method of testing

A package assembly comprising:

• a controller die;
• a first external electrical connector configured for electrical coupling to a first electric power source;
• a second external electrical connector configured for electrical coupling to a second electric power source;
• a microelectromechanical system die electrically coupled with the controller die and further electrically coupled with the first external electrical connector and the second external electrical connector, the microelectromechanical system die including:
• a movable mass,
• a first sense electrode spaced apart from the movable mass at a first location and electrically coupled with the controller die,
• a second sense electrode spaced apart from the movable mass at a second location and electrically coupled with the controller die,
• a first test electrode spaced apart from the movable mass at a third location and electrically coupled with the first external electrical connector, the first test electrode being biased at a first voltage when the first external electrical connector is electrically connected to the first electric power source, and
• a second test electrode spaced apart from the movable mass at a fourth location and electrically coupled to the second external electrical connector, the second test electrode being biased at a second voltage when the second external electrical connector is electrically connected to the second electric power source,
• wherein the controller die is configured to detect a differential between a first capacitance existing between the movable mass and the first sense electrode and a second capacitance existing between the movable mass and the second sense electrode, and wherein the first test electrode and the second test electrode are configured to generate a net electrostatic force to move the movable mass with respect to the first sense electrode and the second sense electrode to create the differential between the first capacitance and the second capacitance when the first external electrical connector or the second external electrical connector are electrically connected to the first electric power source or the second electric power source, respectively.

A method for testing a microelectromechanical system package, the method comprising:

• providing the microelectromechanical system package, the microelectromechanical system package having a test electrode arranged with respect to a movable mass such that a voltage differential between the test electrode and the movable mass can be used to generate a net electrostatic force that can cause the movable mass to move, the test electrode being electrically connected to a first external electrical connector;
• applying a voltage to the first external electrical connector to cause the voltage differential between the test electrode and the movable mass to create the net electrostatic force that moves the movable mass;
• and
• detecting movement of the movable mass with a controller of the microelectromechanical system package.