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US 2013/0256918 A1Published application
Device
AssigneeElpida Memory, Inc.
InventorAtsushi TOMOHIRO
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a wiring board, a first semiconductor chip mounted on the wiring board via a first adhesive member, and second semiconductor chip stacked on the first semiconductor chip via a second adhesive member. The first adhesive member is a die attach film having an adhesive layer formed on both surfaces of an insulating base, and the second adhesive member is an adhesive paste.
Claims20
A device comprising:
- a wiring board;
- a first semiconductor chip mounted on the wiring board via a first adhesive member;
- and
- a second semiconductor chip stacked on the first semiconductor chip via a second adhesive member,
- wherein the first adhesive member comprises a die attach film including adhesive layers on both surfaces of an insulating base, and the second adhesive member comprises an adhesive paste.
2 more elements
A device comprising:
- a wiring board;
- and
- a plurality of semiconductor chips stacked on the wiring board,
- wherein an uppermost semiconductor chip of the plurality of semiconductor chips is bonded to an adjacent one of the semiconductor chips by a paste-type adhesive member, and each of the other semiconductor chips is bonded to an adjacent one of the semiconductor chips or wiring board by a film-type adhesive member including an insulating base.
1 more element
A device comprising:
- a wiring board;
- a first semiconductor chip mounted on the wiring board by a first adhesive member, the first adhesive member consisting of a die attach film including an insulating base, a lower adhesive layer adhered the wiring board to the insulating base, and an upper adhesive layer adhered the first semiconductor chip to the insulating base;
- and
- a second semiconductor chip stacked on the first semiconductor chip by a second adhesive member, and the second adhesive member consisting of an adhesive paste.
1 more element
Dependencies are inferred from the claim text.