Semiconductor device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorsMayumi MORIZUKA, Yoshiharu Takada
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsMayumi MORIZUKA, Yoshiharu Takada
Estimating the term…
According to an embodiment, a semiconductor device includes a first layer including a first nitride semiconductor, a second layer provided on the first layer and including a second nitride semiconductor having a wider bandgap than the first nitride semiconductor. The device also includes a source electrode and a drain electrode provided on the second layer; and a gate electrode provided on the second layer and located between the source electrode and the drain electrode. The second layer includes a first region between the gate electrode and the drain electrode, the first region being selectively provided in a surface of the second layer and contains fluorine. A concentration of fluorine in the first region is higher than a concentration of fluorine in a portion underneath the gate electrode in the second layer.
A semiconductor device comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.