Optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a film, and a method for producing the optoelectronic semiconductor device
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMagnus Ahlstedt, Johann Ramchen
Life of this patent
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Abstract
A semiconductor device includes a radiation-emitting semiconductor chip, a carrier substrate and a film. The carrier substrate has electrically conductive contact tracks on a top side. The film is arranged on a radiation exit side of the chip, the radiation exit side being remote from the carrier substrate, and on the top side of the carrier substrate and has electrically conductive first conductor tracks. The film has perforations arranged such that the semiconductor chip can be electrically contact-connected to the first contact track of the carrier substrate via the first conductor track of the film.
Claims21
An optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a film, wherein
- the semiconductor chip has an active layer that generates radiation,
- the carrier substrate has a first electrically conductive contact track and a second electrically conductive contact track on a top side,
- the semiconductor chip is arranged on the top side of the carrier substrate,
- the film is arranged at least in regions on a radiation exit side of the semiconductor chip, said radiation exit side being remote from the carrier substrate, and on the top side of the carrier substrate,
- the film has at least one electrically conductive first conductor track at least in regions on a top side remote from the carrier substrate, and
- the film has at least one first perforation and at least one second perforation arranged such that the semiconductor chip can be electrically contact-connected to the first contact track of the carrier substrate via the first conductor track of the film.
The semiconductor device according to claim, wherein the diameter of the perforations decreases in a vertical direction from the top side of the film in a direction towards the carrier substrate.
An optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a film, wherein
- the semiconductor chip has an active layer that generates radiation,
- the carrier substrate has a first electrically conductive contact track and a second electrically conductive contact track on a top side,
- the semiconductor chip is arranged on the top side of the carrier substrate,
- the film is arranged at least in regions on a radiation exit side of the semiconductor chip, said radiation exit side being remote from the carrier substrate and on the top side of the carrier substrate,
- the film has at least one electrically conductive first conductor track at least in regions on a top side remote from the carrier substrate,
- the film has at least one first perforation and at least one second perforation arranged such that the semiconductor chip can be electrically contact-connected to the first contact track of the carrier substrate via the first conductor track of the film,
- the perforations perforate the first conductor track in places and the perforations completely penetrate through the first conductor track,
- an electrical contact-connection between the semiconductor chip and the first conductor track is formed by contact drops that are respectively introduced into a respective perforation of the film, and
- a material of the contact drops differs from a material of the first conductor track.
Dependencies are inferred from the claim text.