Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive

A laser-soldering tool for laser-soldering head-connection pads of a head-stack assembly for a hard-disk drive, said laser-soldering tool comprising:

• a laser;
• and
• a solder-jet nozzle comprising:
• a body including a tip, said tip disposed at a distal end of said body configured to deliver a solder ball in proximity to said head-connection pads of a head-gimbal assembly that is disposed in said head-stack assembly;
• a central duct disposed along a central axis of said body, and configured to convey said solder ball to said tip;
• and
• an outer surface of said body comprising:
• a first portion substantially coinciding with portions of a conical surface of a cone, an axis of said cone disposed about along said central axis of said body;
• and
• at least a first flat contiguous with said first portion, disposed about parallel to said central axis of said body, and intersecting said conical surface of said cone;
• and
• wherein said laser is configured to melt said solder ball disposed at said tip.

A method for laser-soldering head-connection pads of a head-stack assembly for a hard-disk drive with a laser-soldering tool, said method comprising:

• disposing a solder-jet nozzle of said laser-soldering tool with a central axis of a body of said solder-jet nozzle aligned about parallel to a force field;
• placing head-connection pads of a head-gimbal assembly disposed in a head-stack assembly below a tip of said body of said solder-jet nozzle, a pair of head-connection pads configured to receive a solder ball released from said tip in a molten state;
• irradiating a solder ball at said tip of said solder-jet nozzle with a laser of said laser-soldering tool to melt said solder ball;
• releasing said solder ball in said molten state from said tip to be transported onto said pair of head-connection pads comprising a head-connection pad of a first plurality of head-connection pads of a head-slider and a matching head-connection pad of a second plurality of head-connection pads of a lead-suspension;
• and
• forming a solder joint between said pair of head-connection pads;
• and
• wherein a first flat of an outer surface of said body enables a tip of said body of said solder-jet nozzle to approach said pair of head-connection pads without said body of said solder-jet nozzle interfering with an opposite-facing-twin load-beam of an opposite-facing-twin head-gimbal assembly in said head-stack assembly.