Composition for forming resist underlayer film, and pattern-forming method
AssigneeJsr Corporation
InventorsHiromitsu TANAKA, Junya SUZUKI, Masayuki MOTONARI, Tooru KIMURA
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Abstract
A composition for forming a resist underlayer film includes a polysiloxane, and a solvent composition. The solvent composition includes an organic solvent which includes a compound represented by the following formula (1) or a carbonate compound and which has a standard boiling point of no less than 150.0° C. R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms. R3 represents a hydrogen atom or a methyl group. n is an integer of 1 to 4. In a case where n is no less than 2, a plurality of R3s are identical or different.
Claims11
A composition for forming a resist underlayer film, comprising:
- a polysiloxane;
- and
- a solvent composition comprising:
- an organic solvent which includes a compound represented by a formula (I) or a carbonate compound and which has a standard boiling point of no less than 150.0° C.,
- wherein, in the formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms;
- R3 is represents a hydrogen atom or a methyl group;
- n is an integer of 1 to 4, in a case where n is no less than 2, a plurality of R3s are identical or different.
Dependencies are inferred from the claim text.