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US 2013/0256018 A1Published application
Circuit substrate, laminated board and laminated sheet
AssigneeKYOCERA Corporation
InventorKatsura HAYASHI
Life of this patent
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Abstract
A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.
Claims13
A circuit substrate comprising:
- a first resin layer,
- a first inorganic insulating layer,
- a first groove portion penetrating the first inorganic insulating layer in a thickness direction thereof, and
- a second inorganic insulating layer,
- wherein the first resin layer is between the first inorganic insulating layer and the second inorganic insulating layer, and a part of the first resin layer is in the first groove portion.
2 more elements
Dependencies are inferred from the claim text.