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US 2013/0256016 A1Published application
Printed circuit board and manufacturing method thereof
AssigneeFujitsu Limited
InventorMasakazu TAKESUE
Life of this patent
Estimating the term…
Abstract
An embodiment of a printed circuit board includes: a mounting board with a solder resist on a front surface thereof; a component mounted on the mounting board; an underfill material that fixes the component to the mounting board; and resin materials dotted between the solder resist and the underfill material.
Claims11
A printed circuit board, comprising:
- a mounting board with a solder resist on a front surface thereof;
- a component mounted on the mounting board;
- an underfill material that fixes the component to the mounting board;
- and
- resin materials dotted between the solder resist and the underfill material.
2 more elements
A manufacturing method of a printed circuit board, comprising:
- dotting resin materials on a solder resist on a front surface of a mounting board;
- mounting a component on the mounting board;
- and
- providing an underfill material that fixes the component to the mounting board in a gap between the mounting board and the component and in a gap between the resin materials and the component.
1 more element
Dependencies are inferred from the claim text.