Metallized substrate, metal paste composition, and method for manufacturing metallized substrate
AssigneeTokuyama Corporation
InventorsNaoto Takahashi, Yasuyuki Yamamoto, Emi Ushioda
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Abstract
The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (10); a titanium nitride layer (20) on the sintered substrate (10); an adhesion layer (30) on the titanium nitride layer (20); and a copper plating layer (40) on or above the adhesion layer (30), wherein the adhesion layer (30) contains copper and titanium, and has a thickness of no less than 0.1 μm and no more than 5 μm.
Claims20
A metallized substrate comprising:
- a sintered nitride ceramic substrate;
- a titanium nitride layer on the sintered substrate;
- an adhesion layer on the titanium nitride layer;
- and
- a copper plating layer on or above the adhesion layer,
- wherein the adhesion layer contains copper and titanium, and has a thickness of 0.1 μm to 5 μm.
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A method for manufacturing a metallized substrate comprising the steps of:
- (i) applying a metal paste composition on a whole surface of a side of a nitride ceramic sinter where a metallized pattern is to be formed, wherein the metal paste composition comprises:
- a metal component containing a copper powder and a titanium hydride powder, and not containing a silver powder;
- and a high-viscosity solvent having a viscosity at 25° C. of no less than 100 Pa·s, and wherein the metal paste composition contains 5 to 50 mass parts of said titanium hydride powder and 10 to 50 mass parts of said high-viscosity solvent per 100 mass parts of said copper powder,
- (ii) firing a substrate obtained through the step (i), thereby forming a titanium nitride layer and an adhesion layer in the order mentioned on or above the nitride ceramic sinter;
- (iii) forming a copper plating layer on the adhesion layer;
- (iv) forming a resist pattern on a part of the copper plating layer to be left as a wiring pattern, by a photolithographic method;
- (v) removing a part of the copper plating layer and the adhesion layer where the resist pattern is not formed, by an etching process;
- (vi) removing the resist pattern;
- and
- (vii) etching an exposed part of the titanium nitride layer.
A method for manufacturing a metallized substrate comprising the steps of:
- (i) applying a metal paste composition on a whole surface of a side of a nitride ceramic sinter where a metallized pattern is to be formed, wherein the metal paste composition comprises:
- a metal component containing a copper powder and a titanium hydride powder, and not containing a silver powder;
- and a high-viscosity solvent having a viscosity at 25° C. of no less than 100 Pa·s, and wherein the metal paste composition contains 5 to 50 mass parts of said titanium hydride powder and 10 to 50 mass parts of said high-viscosity solvent per 100 mass parts of said copper powder,
- (ii) firing a substrate obtained through the step (i), thereby forming a titanium nitride layer and an adhesion layer in the order mentioned on or above the nitride ceramic sinter;
- (iii) forming a resist pattern on a part of the adhesion layer where a wiring pattern is not to be formed, by a photolithographic method;
- (iv) forming a copper plating layer on a part of the adhesion layer where the resist pattern is not formed;
- (v) removing the resist pattern;
- (vi) etching an exposed part of the adhesion layer;
- and
- (vii) etching an exposed part of the titanium nitride layer.
Dependencies are inferred from the claim text.