Method of manufacturing multilayer printed circuit board and multilayer printed circuit board manufactured via the same

Abstract

Disclosed herein are a method of manufacturing a multilayer printed circuit board (PCB), a via which is an inner via hole (IVH) having a stable structure so as to easily form a fine pattern, thereby thinning a product, and a multilayer PCB manufactured via the same. The method includes preparing a base substrate including copper foils formed on opposite surfaces or a single surface of the base substrate; forming an insulating layer on the base substrate via a coating process; processing a via hole through the insulating layer formed on the base substrate up to the base substrate; performing fill plating on the via hole; and stacking at least one circuit layer on a metal layer that is formed via the fill plating.

Dependencies are inferred from the claim text.