Flexible printed wiring board and laminate for production of flexible printed wiring board

A flexible printed wiring board, comprising

• a first insulating layer that is flexible,
• a first conductor wiring laminated on the first insulating layer,
• a second insulating layer that is formed of multiple layers and laminated on the first insulating layer,
• as it covers the first conductor wiring, and
• a second conductor wiring laminated on the second insulating layer, wherein:
• the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
• a thickness from a surface of the first conductor wiring to a surface of a layer directly laminated on the first insulating layer, among the multiple layers constituting the second insulating layer, is in the range of 5 to 30 μm;
• and
• a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less.

A laminate for production of a flexible printed wiring board comprising:

• a first insulating layer that is flexible,
• a first conductor wiring laminated on the first insulating layer,
• a second insulating layer that is a single layer and laminated on the first insulating layer, as it covers the first conductor wiring, and
• a metal foil laminated on the second insulating layer, wherein
• the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
• a thickness from a surface of the first conductor wiring to a surface of the second insulating layer is in the range of 5 to 30 μm;
• and
• a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less.

A laminate for production of a flexible printed wiring board comprising

• a first insulating layer that is flexible,
• a first conductor wiring laminated on the first insulating layer,
• a second insulating layer that is formed of multiple layers and laminated on the first insulating layer, as it covers the first conductor wiring, and
• a metal foil laminated on the second insulating layer, wherein
• the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
• a thickness from a surface of the first conductor wiring to a surface of a layer directly laminated on the first insulating layer, among the multiple layers constituting the second insulating layer, is in the range of 5 to 30 μm;
• and
• a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less.