Curable adhesive composition
OwnerPierre R. Bieber, Siegfried R. Goebinventors
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Abstract
The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group.
Claims16
1-17. (canceled)
A method for bonding at least two substrates together, the method comprising:
- a) providing a mixed adhesive composition by mixing a first part and a second part of a curable adhesive composition in an appropriate ratio, wherein
- i) the first part comprises at least one epoxy resin;
- and
- ii) the second part comprises at least one curing agent in the form of an epoxy-amine adduct or an epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine, and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group;
- b) covering one or both substrates at least partially with the mixed adhesive composition, wherein one or both substrates are covered with an oil layer, which is not removed before applying the mixed adhesive composition;
- c) bringing the substrates into contact in a section covered with the mixed adhesive composition;
- and
- d) curing the mixed adhesive composition.
A curable adhesive composition comprising a first part and a second part, wherein
- a) the first part comprises at least one epoxy resin;
- and
- b) the second part comprises at least one curing agent in the form of an epoxy-thiol adduct obtainable by reacting at least one thiol with at least one polyol compound comprising at least one terminal epoxy group.
Dependencies are inferred from the claim text.