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US 2013/0255873 A1Published application
Processing substrates using a temporary carrier
AssigneePlastic Logic Limited
InventorJames Watts
Life of this patent
Estimating the term…
Abstract
A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.
Claims15
A method, comprising:
- securing a device substrate to a carrier using one or more adhesive elements;
- forming electronic elements on the device substrate with the device substrate thus secured to the carrier;
- and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.
A method, comprising:
- securing a substrate to a carrier using one or more adhesive elements;
- processing the substrate with the substrate thus secured to the carrier;
- and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier, wherein the substrate is secured to the carrier using an adhesive unit comprising adhesive layers supported on opposite sides of a support element;
- and comprising preferentially reducing the adhesion strength of the adhesive layer between the support element and one of the substrate and carrier, and removing said one of the substrate and carrier from the adhesive unit without removing the other of the substrate and the carrier from the adhesive unit.
1 more element
Dependencies are inferred from the claim text.