Method and arrangement for attaching a chip to a printed conductive surface
AssigneeStora Enso OYJ
InventorsJuha Maijala, Petri Sirviö
Life of this patent
Estimating the term…
Abstract
A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.
Claims19
1-16. (canceled)
A method for attaching a chip to a printed conductive surface, the method comprising:
- heating the chip to a first temperature, which is lower than what the chip can stand without being damaged by the heat;
- and
- pressing the heated chip against the printed conductive surface with a first pressing force;
- wherein a combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least the printed conductive surface.
An apparatus for attaching a chip to a printed conductive surface, the apparatus comprising:
- a heater configured to heat a chip to a first temperature, which is lower than what the chip can stand without being damaged by the heat;
- and
- an actuator configured to press the heated chip against the printed conductive surface with a first pressing force;
- wherein the apparatus is configured to apply said first temperature and said first pressing force in a combination sufficient to at least partly melt the material of at least the printed conductive surface.
Dependencies are inferred from the claim text.