# US 2013/0239702 A1 · Double Die Sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0239702 A1 - Document ID: US20130239702A1 - Status: Published application - Kind: A1 - Application number: 13/421,191 - Filed: 2012-03-15 - Published: 2013-09-19 - Earliest claimed: 2012-03-15 - Assignees: Infineon Technologies AG - Inventors: Udo Ausserlechner - Web page: https://patentgrep.com/patent/US20130239702A1 ## CPC - G01D 3/0365: {the undesired influence being measured using a separate sensor, which produces an influence related signal} - G01R 33/0041: {using feed-back or modulation techniques} - G01R 33/07: Hall effect devices - H10D 48/40: Devices controlled by magnetic fields - H10W 90/753: {between laterally-adjacent chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract One embodiment of the present invention relates to a device, such as a sensor device. The device includes a sensor die and a circuit die. The sensor die includes a sensor and a feedback component. The circuit die includes circuitry. The circuit die is varied from the sensor die, such as comprising a varied substrate material. The circuitry is coupled to the sensor and the feedback component. The circuitry and the feedback component can communicate correlation information. ## Claims ### Claim 1 A sensor device comprising: a sensor die having a sensor and a feedback component; and a circuit die having circuitry, the circuit die being varied from the sensor die; and wherein the circuitry is coupled to the sensor and the feedback component. ### Claim 2 (depends on 1) The device of claim 1, wherein the sensor die is comprised of silicon and the circuit die is comprised of a type III/V material. ### Claim 3 (depends on 2) The device of claim 2, wherein the type III/N material is GaAs. ### Claim 4 (depends on 2) The device of claim 2, wherein the silicon has a crystal structure of (100). ### Claim 5 (depends on 1) The device of claim 1, wherein the feedback component and the circuitry share correlation information. ### Claim 6 (depends on 5) The device of claim 5, wherein the circuitry alters supply power to the sensor based on the correlation information. ### Claim 7 (depends on 5) The device of claim 5, wherein the circuitry conditions an output signal at least partially based on the correlation information. ### Claim 8 (depends on 1) The device of claim 1, wherein the sensor is a hall effect sensor that provides a sensor output signal to the circuitry, wherein the circuitry is configured to perform signal conditioning on the sensor output signal. ### Claim 9 (depends on 1) The device of claim 1, wherein the feedback component is a resistor. ### Claim 10 (depends on 1) The device of claim 1, wherein the feedback component is a thermistor. ### Claim 11 (depends on 1) The device of claim 1, further comprising a die paddle onto which the sensor die and the circuit die are affixed. ### Claim 12 (depends on 11) The device of claim 11, further comprising a package lead coupled to the circuitry. ### Claim 13 A sensor device comprising: a sensor located on a sensor die, the sensor having a power input and a sensor output, wherein the sensor is configured to provide a sensor output signal at the sensor output; a feedback component located on the sensor die and coupled to the sensor; power circuitry located on a circuit die, the circuit die being varied from the sensor die and the power circuitry configured to provide supply power to the power input of the sensor and to obtain correlation information from the feedback component; and an output component located on the circuit die, the output component configured to amplify the sensor output from the sensor. ### Claim 14 (depends on 13) The device of claim 13, wherein the sensor is a pressure sensor and provides a pressure signal as the sensor output signal. ### Claim 15 (depends on 13) The device of claim 13, wherein the sensor is a hall effect sensor and provides a magnetic field measurement signal as the sensor output signal. ### Claim 16 (depends on 13) The device of claim 13, wherein the power circuitry provides a copy of a voltage source to the feedback component. ### Claim 17 (depends on 13) The device of claim 13, wherein the power circuitry utilizes an output of the feedback component as a reference voltage. ### Claim 18 A method of operating a sensor device, the method comprising: providing a sensor die and a circuit die, the sensor die and the circuit die being varied; generating a sensor signal by a sensor located on the sensor die; generating a feedback signal by a feedback component located on the sensor die, the feedback signal comprising correlation information; providing a supply power to the sensor by circuitry located on the circuit die; generating an output signal by the circuitry on the circuit die according to the sensor signal and the feedback signal. ### Claim 19 (depends on 18) The method of claim 18, further comprising modifying the supply power according to the correlation information. ### Claim 20 (depends on 18) The method of claim 18, further comprising mitigating thermal variations between the sensor die and the circuit die by connecting bonding wires from the sensor die and the circuit die to package leads.