# US 2013/0239696 A1 · Sensor device with stepped pads for connectivity > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0239696 A1 - Document ID: US20130239696A1 - Status: Published application - Kind: A1 - Application number: 13/420,915 - Filed: 2012-03-15 - Published: 2013-09-19 - Earliest claimed: 2012-03-15 - Assignees: Meggitt (Orange County), Inc. - Inventors: James Letterneau - Web page: https://patentgrep.com/patent/US20130239696A1 ## CPC - G01D 11/245: {Housings for sensors} - G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ## Abstract A sensor device includes at least one sensor device coupled to a substrate. A solder pad interface includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad. A cable with a plurality of cable leads, is configured for each of a cable lead to be coupled to a solder pad. ## Claims ### Claim 1 A sensor device, comprising: a substrate; at least one sensor coupled to the substrate; and a solder pad interface that includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad; a cable with a plurality of cable leads, each of a cable lead being coupled to a solder pad. ### Claim 2 (depends on 1) The device of claim 1, wherein the cable leads are in a stacked geometric configuration when coupled with the solder pads. ### Claim 3 (depends on 1) The device of claim 1, wherein the device has a package seize of about wherein the device has a package with an area in the range of 0.04 in2 [0.26 cm2] to 5.4 in2 [35 cm2] and a volume within the range of 0.003 in3 [0.05 cm3] to 8.1 in3 [133 cm3]. ### Claim 4 (depends on 1) The device of claim 1, wherein the solder pad interface is configured to minimize a volumetric space between the cable leads and the solder pad interface and minimize a volume between cable and wire, and solder pad interface structure. ### Claim 5 (depends on 1) The sensor device of claim 1, wherein the sensor is a triaxial sensor. ### Claim 6 (depends on 5) The sensor device of claim 5, wherein the sensor has a same footprint area of a single axis sensor. ### Claim 7 (depends on 1) The sensor device of claim 1, wherein the solder pad interface is integral with the substrate. ### Claim 8 (depends on 1) The sensor device of claim 1, wherein the solder pad interface is a high temperature ceramic interface. ### Claim 9 (depends on 1) The sensor device of claim 1, wherein the solder pad interface is a PC board. ### Claim 10 (depends on 1) The sensor device of claim 1, wherein the solder pad interface has a first series of steps on a first side and a second series of steps on an opposing second side. ### Claim 11 (depends on 1) The sensor of claim 1, wherein the sensor includes at least two solder pad interfaces that includes a plurality of steps, with at least a portion of the steps at different planes, each of a step having a solder pad. ### Claim 12 (depends on 1) The sensor device of claim 1, wherein the sensor device includes three sensors. ### Claim 13 (depends on 1) The sensor device of claim 1, where the sensor is selected from at least one of acoustic, electrical, position, pressure, thermal, piezoresistive, accelerometer and photo. ### Claim 14 (depends on 1) The sensor device of claim 1, further comprising: a housing with the sensor device positioned in an interior of the housing, the housing include a port for receiving the cable. ### Claim 15 (depends on 1) The sensor device of claim 1, wherein the interface is a metalized substrate. ### Claim 16 (depends on 1) The sensor device of claim 1, further comprising: a central pedestal support portion coupled to the substrate; an elastic semiconductor diaphragm portion coupled to and peripherally surrounding the central pedestal support portion and extending generally parallel to the substrate; a mass portion coupled to and peripherally surrounding the diaphragm portion and spaced from the substrate, the mass portion being movable in response to acceleration to cause bending movement of the diaphragm portion; and wherein the sensor is coupled to the diaphragm portion for detecting strain induced in the diaphragm portion in response to bending movement of the diaphragm portion for providing an output signal. ### Claim 17 (depends on 16) The sensor device of claim 16, wherein the mass portion is constructed to move in response to acceleration in each of three orthogonal axes and outputs are provided representing acceleration in each of the three orthogonal axes. ### Claim 18 (depends on 16) The sensor device of claim 16, wherein the substrate is an electrically non-conductive substrate and the support portion, diaphragm portion, and mass portion, are integrally formed from a single piece of semiconductive material. ### Claim 19 (depends on 16) The sensor device of claim 16, wherein the support portion, diaphragm portion, and mass portion are etched from a single piece of semiconductor material.